Wafer/Photomask & Substrate Cleaning Systems

The glue-spreading developing machine generally consists of four parts. The first part is the wafer cassette station, where the wafer cassettes are loaded onto the machine. The robot arm pulls the wafer out of the cassette and transfers it to the process block, the second part. The process part is the main body of the glue-spraying and developing machine. The main process units such as adhesion enhancement, hot plate, chill plate, spin coating, and development are all installed here. One or two manipulators are installed here. Transfer wafers between units. The third part is the supporting unit for the immersion lithography process, including the wafer surface water washing unit and the back cleaning unit. The fourth part is the interface with the lithography machine, including the buffer box (buffer) for temporarily storing wafers, wafer edge exposure (WEE) and the interface for the lithography machine to exchange wafers, etc.