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EBR邊緣清洗機
EBR邊緣清洗機
Categories:
Wafer Fabrication
,
Wafer/Photomask & Substrate Cleaning Systems
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General Details
產品視頻
特點:
1、方形基片的邊緣清洗
2、邊緣區域:1-20mm
3、基片厚度要求:0.5-20mm
4、自動對準邊緣尺寸
5、液體可選可增配
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