晶圆减薄机 (Okamoto)

Okamoto Precision System – GRIND-X GNX-300

• The 300mm Back Grinder

Features:

1. Down Feed Grinding
2. Highly Accurate Grinding Spindle
3. Rigid Work Spindle
4. Accurate Index Table
5. Chuck Cleaning system
6. Wafer Cleaning system
7. Handling system
8. 2-port System
9. Automation

The system can be upgraded to Inline Polisher + Mounter for thin wafer process (GNX300GPM).